Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183596 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh | 2024-12-31 |
| 11955434 | Ultra small molded module integrated with die by module-on-wafer assembly | Eric J. Li, Shawna M. Liff, Javier A. Falcon, Joshua D. Heppner | 2024-04-09 |