Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183596 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Debendra Mallik, Yoshihiro Tomita | 2024-12-31 |
| 12130482 | Hydrophobic feature to control adhesive flow | Jingyi Huang, Yiqun Bai, Ziyin Lin, Vipul V. Mehta, Joseph Van Nausdle | 2024-10-29 |