Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132015 | Package embedded magnetic inductor structures and manufacturing techniques for 5-50 MHZ SMPS operations | William J. Lambert | 2024-10-29 |
| 12062551 | High density organic interconnect structures | Siddharth K. Alur, Lilia May, Amanda E. Schuckman | 2024-08-13 |
| 12033930 | Selectively roughened copper architectures for low insertion loss conductive features | Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng +9 more | 2024-07-09 |
| 11935805 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2024-03-19 |
| 11869842 | Scalable high speed high bandwidth IO signaling package architecture and method of making | Sanka Ganesan, Robert L. Sankman, Arghya Sain, Lijiang Wang, Cemil Geyik | 2024-01-09 |
| 11870163 | Antenna package using ball attach array to connect antenna and base substrates | Jimin Yao, Robert L. Sankman, Shawna M. Liff, William J. Lambert, Zhichao Zhang | 2024-01-09 |