Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062551 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Lilia May, Amanda E. Schuckman | 2024-08-13 |
| 11935805 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2024-03-19 |