Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154715 | Methods to selectively embed magnetic materials in substrate and corresponding structures | Cheng Xu, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more | 2024-11-26 |
| 11942406 | Semiconductor packages with embedded interconnects | Dilan Seneviratne, Ravindranadh Eluri | 2024-03-26 |
| 11935805 | Package with underfill containment barrier | Rahul Jain, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2024-03-19 |
| 11901115 | Substrate assembly with encapsulated magnetic feature | Rahul Jain, Sai Vadlamani, Cheng Xu, Ji-Yong Park, Junnan Zhao +1 more | 2024-02-13 |
| 11862552 | Methods of embedding magnetic structures in substrates | Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Rahul Jain, Lauren A. Link +2 more | 2024-01-02 |