Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11881463 | Coreless organic packages with embedded die and magnetic inductor structures | Andrew J. Brown, Rahul Jain, Prithwish Chatterjee, Sai Vadlamani | 2024-01-23 |
| 11862552 | Methods of embedding magnetic structures in substrates | Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Rahul Jain, Andrew J. Brown +2 more | 2024-01-02 |