Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11881463 | Coreless organic packages with embedded die and magnetic inductor structures | Andrew J. Brown, Rahul Jain, Lauren A. Link, Sai Vadlamani | 2024-01-23 |
| 11862552 | Methods of embedding magnetic structures in substrates | Sai Vadlamani, Robert Alan May, Rahul Jain, Lauren A. Link, Andrew J. Brown +2 more | 2024-01-02 |