| 12154715 |
Methods to selectively embed magnetic materials in substrate and corresponding structures |
Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more |
2024-11-26 |
| 12087746 |
Microelectronic assemblies having an integrated capacitor |
Chong Zhang, Junnan Zhao, Ying Wang, Meizi Jiao |
2024-09-10 |
| 12026106 |
Dynamic compression for multiprocessor platforms and interconnects |
Keqiang Wu, Zhidong Yu, Samuel Ortiz, Weiting Chen |
2024-07-02 |
| 11901115 |
Substrate assembly with encapsulated magnetic feature |
Kyu Oh Lee, Rahul Jain, Sai Vadlamani, Ji-Yong Park, Junnan Zhao +1 more |
2024-02-13 |
| 11894282 |
Vented lids for integrated circuit packages |
Zhimin Wan, Sergio Antonio Chan Arguedas, Peng Li, Chandra Mohan Jha, Aravindha R. Antoniswamy +2 more |
2024-02-06 |