CZ

Chong Zhang

AL Ayar Labs: 3 patents #6 of 24Top 25%
IN Intel: 2 patents #991 of 4,430Top 25%
GT Guangdong University Of Technology: 1 patents #32 of 136Top 25%
TE Tencent: 1 patents #384 of 1,241Top 35%
UC University Of South China: 1 patents #1 of 17Top 6%
BO BOE: 1 patents #1,531 of 2,939Top 55%
TO Toyota: 1 patents #1,411 of 3,632Top 40%
Overall (2024): #5,954 of 561,600Top 2%
13
Patents 2024

Issued Patents 2024

Patent #TitleCo-InventorsDate
12172197 Laser cavitation composite ultrasonic cleaning device and cleaning method for connecting rod Guan Wang, Junxian Li, Sihao Lin, Jieyu Zhu, Guohua Chen 2024-12-24
12168813 Electrokinetic device and method for in-situ leaching of uranium Chunguang Li, Longcheng Liu, Kaixuan Tan, Zhenzhong Liu, Yongmei Li +4 more 2024-12-17
12155186 Sealing device and underwater machinery equipment WEI-CHENG LING, Jun Huang 2024-11-26
12104922 Synchronizing neighboring tiles in a high definition map Hai Jin, Federico BONIARDI, Xipeng Wang, Paul J. Ozog 2024-10-01
12098096 United states low dielectric sealing glass powder for miniature radio-frequency glass insulator Shou Peng, Weiwei WANG, Changqing Li, Jinwei Li, Xiaofei Yang +13 more 2024-09-24
12087069 Artificial intelligence-based action recognition method and related apparatus Wanchao CHI, Yonggen Ling, Wei Liu, Zhengyou Zhang, Zejian Yuan +2 more 2024-09-10
12087746 Microelectronic assemblies having an integrated capacitor Cheng Xu, Junnan Zhao, Ying Wang, Meizi Jiao 2024-09-10
12066865 Adjustable frame and foldable display device Baofeng Sun, Yonghong Zhou, Yanyan Yang, Shangchieh Chu, Pengfei Zhou +3 more 2024-08-20
12062469 Waterproof sealing structure for a cable and communication device WEI-CHENG LING 2024-08-13
12019269 Multi-chip packaging of silicon photonics Roy Meade, Haiwei Lu, Chen Li 2024-06-25
11923312 Patternable die attach materials and processes for patterning Bai Nie, Gang Duan, Srinivas V. Pietambaram, Jesse C. Jones, Yosuke Kanaoka +10 more 2024-03-05
11914203 Hybrid multi-wavelength source and associated methods Michael Davenport, Mark Wade 2024-02-27
11899251 Vertical integrated photonics chiplet for in-package optical interconnect Roy Meade 2024-02-13