Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12019269 | Multi-chip packaging of silicon photonics | Roy Meade, Chong Zhang, Haiwei Lu | 2024-06-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12019269 | Multi-chip packaging of silicon photonics | Roy Meade, Chong Zhang, Haiwei Lu | 2024-06-25 |