Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12174419 | Thin film lithium niobate hybrid photonics packaging | Mian Zhang, Christian Reimer | 2024-12-24 |
| 12092880 | Beam steering structure with integrated polarization splitter | John Fini, Derek Van Orden, Mark Wade | 2024-09-17 |
| 12057332 | Wafer-level etching methods for planar photonics circuits and devices | Chen Sun, Mark Wade, Alexandra Wright, Vladimir Stojanovic | 2024-08-06 |
| 12019269 | Multi-chip packaging of silicon photonics | Chong Zhang, Haiwei Lu, Chen Li | 2024-06-25 |
| 12014962 | Systems and methods for wafer-level photonic testing | Anatol Khilo, Forrest Sedgwick, Alexandra Wright | 2024-06-18 |
| 11994724 | Chip-to-chip optical data communication system | Alexandra Wright, Mark Wade, Chen Sun, Vladimir Stojanovic, Rajeev Ram +2 more | 2024-05-28 |
| 11916602 | Remote memory architectures enabled by monolithic in-package optical i/o | Vladimir Stojanovic, Chen Sun, Mark Wade, Hugo Saleh, Charles Wuischpard | 2024-02-27 |
| 11899251 | Vertical integrated photonics chiplet for in-package optical interconnect | Chong Zhang | 2024-02-13 |
| 11867944 | Photonic systems to enable top-side wafer-level optical and electrical test | Chen Sun, Shahab Ardalan, John Fini, Forrest Sedgwick | 2024-01-09 |