Issued Patents 2024
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125793 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Srinivas V. Pietambaram, Rahul N. Manepalli | 2024-10-22 |
| 12125777 | Minimizing package impedance discontinuity through dielectric structure optimizations | Zhiguo Qian, Kemal Aygun, Jieying Kong, Brandon C. Marin | 2024-10-22 |
| 12088560 | Network context monitoring within service mesh containerization environment | Yuncong Feng | 2024-09-10 |
| 12087695 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Srinivas V. Pietambaram, Rahul N. Manepalli | 2024-09-10 |
| 12009320 | Interconnect loss of high density package with magnetic material | Zhiguo Qian, Cemil Geyik, Jiwei Sun, Kemal Aygun | 2024-06-11 |
| 11990427 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Deepak Kulkarni, Rahul N. Manepalli, Xiaoying Guo | 2024-05-21 |
| 11978685 | Glass core patch with in situ fabricated fan-out layer to enable die tiling applications | Srinivas V. Pietambaram, Robert L. Sankman, Rahul N. Manepalli, Debendra Mallik | 2024-05-07 |
| 11973041 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Deepak Kulkarni, Rahul N. Manepalli, Xiaoying Guo | 2024-04-30 |
| 11966463 | Automatic deployment of application security policy using application manifest and dynamic process analysis in a containerization environment | Glen K. Kosaka, Fei Huang | 2024-04-23 |
| 11929212 | Method to form high capacitance thin film capacitors (TFCs) as embedded passives in organic substrate packages | Sameer Paital, Srinivas V. Pietambaram, Kristof Darmawikarta | 2024-03-12 |
| 11923312 | Patternable die attach materials and processes for patterning | Bai Nie, Srinivas V. Pietambaram, Jesse C. Jones, Yosuke Kanaoka, Hongxia Feng +10 more | 2024-03-05 |
| 11923307 | Microelectronic structures including bridges | Bai Nie, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng, Wei-Lun Kane Jen +6 more | 2024-03-05 |
| 11886573 | Vertically integrated automatic threat level determination for containers and hosts in a containerization environment | Henrik Rosendahl, Fei Huang | 2024-01-30 |