Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12009320 | Interconnect loss of high density package with magnetic material | Zhiguo Qian, Jiwei Sun, Gang Duan, Kemal Aygun | 2024-06-11 | $21,221,000 |
| 11869842 | Scalable high speed high bandwidth IO signaling package architecture and method of making | Sanka Ganesan, Robert L. Sankman, Arghya Sain, Sri Chaitra Jyotsna Chavali, Lijiang Wang | 2024-01-09 | $30,329,000 |