Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009320 | Interconnect loss of high density package with magnetic material | Zhiguo Qian, Jiwei Sun, Gang Duan, Kemal Aygun | 2024-06-11 |
| 11869842 | Scalable high speed high bandwidth IO signaling package architecture and method of making | Sanka Ganesan, Robert L. Sankman, Arghya Sain, Sri Chaitra Jyotsna Chavali, Lijiang Wang | 2024-01-09 |