Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12107042 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravi Mahajan | 2024-10-01 | $20,560,000 |
| 12080632 | Glass core package substrates | Rahul Agarwal, Rajasekaran Swaminathan, Chintan Buch | 2024-09-03 | $326,917,000 |
| 11990427 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Gang Duan, Rahul N. Manepalli, Xiaoying Guo | 2024-05-21 | $18,840,000 |
| 11984396 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravi Mahajan | 2024-05-14 | $33,809,000 |
| 11973041 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Gang Duan, Rahul N. Manepalli, Xiaoying Guo | 2024-04-30 | $26,151,000 |