Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087679 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more | 2024-09-10 |
| 12080632 | Glass core package substrates | Deepak Kulkarni, Rahul Agarwal, Rajasekaran Swaminathan | 2024-09-03 |
| 11931855 | Planarization methods for packaging substrates | Han-Wen Chen, Steven Verhaverbeke, Tapash Chakraborty, Prayudi Lianto, Prerna Goradia +3 more | 2024-03-19 |
| 11927885 | Fluoropolymer stamp fabrication method | Roman Gouk, Jean Delmas, Steven Verhaverbeke | 2024-03-12 |
| 11881447 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more | 2024-01-23 |
| 11862546 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +2 more | 2024-01-02 |