Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087679 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kurtis Leschkies, Roman Gouk +4 more | 2024-09-10 |
| 11925073 | Stretchable polymer and dielectric layers for electronic displays | Byung Sung Kwak, Robert Jan Visser | 2024-03-05 |
| 11887934 | Package structure and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +1 more | 2024-01-30 |
| 11881447 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kurtis Leschkies, Roman Gouk +4 more | 2024-01-23 |
| 11862546 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kurtis Leschkies, Roman Gouk +2 more | 2024-01-02 |