Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087679 | Package core assembly and fabrication methods | Han-Wen Chen, Giback Park, Kyuil Cho, Kurtis Leschkies, Roman Gouk +4 more | 2024-09-10 |
| 11931855 | Planarization methods for packaging substrates | Han-Wen Chen, Tapash Chakraborty, Prayudi Lianto, Prerna Goradia, Giback Park +3 more | 2024-03-19 |
| 11927885 | Fluoropolymer stamp fabrication method | Roman Gouk, Jean Delmas, Chintan Buch | 2024-03-12 |
| 11887934 | Package structure and fabrication methods | Han-Wen Chen, Giback Park, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more | 2024-01-30 |
| 11881447 | Package core assembly and fabrication methods | Han-Wen Chen, Giback Park, Kyuil Cho, Kurtis Leschkies, Roman Gouk +4 more | 2024-01-23 |
| 11862546 | Package core assembly and fabrication methods | Han-Wen Chen, Giback Park, Kyuil Cho, Kurtis Leschkies, Roman Gouk +2 more | 2024-01-02 |