Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080632 | Glass core package substrates | Deepak Kulkarni, Rahul Agarwal, Chintan Buch | 2024-09-03 |
| 12051647 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Andrew Collins, Bharat P. Penmecha, Ram Viswanath | 2024-07-30 |