Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12107042 | Localized high density substrate routing | Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2024-10-01 | $20,560,000 |
| 11984396 | Localized high density substrate routing | Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2024-05-14 | $33,809,000 |
| 11923257 | Hybrid microelectronic substrates | Robert L. Sankman, Scott M. Mokler, Richard C. Stamey, Amruthavalli Pallavi Alur | 2024-03-05 | $29,696,000 |