Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11929295 | Multi-use package architecture | Eng Huat Goh, Jiun Hann Sir, Min Suet Lim, Chu Aun Lim, Jimin Yao | 2024-03-12 |
| 11923257 | Hybrid microelectronic substrates | Robert Starkston, Robert L. Sankman, Scott M. Mokler, Amruthavalli Pallavi Alur | 2024-03-05 |