Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002793 | Integrating system in package (SiP) with input/output (IO) board for platform miniaturization | Wee Hoe, Khang Choong Yong, Ping Ping Ooi | 2024-06-04 |
| 11929295 | Multi-use package architecture | Jiun Hann Sir, Min Suet Lim, Richard C. Stamey, Chu Aun Lim, Jimin Yao | 2024-03-12 |
| 11908793 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Amruthavalli Pallavi Alur, Debendra Mallik | 2024-02-20 |