Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002793 | Integrating system in package (SiP) with input/output (IO) board for platform miniaturization | Eng Huat Goh, Wee Hoe, Ping Ping Ooi | 2024-06-04 |
| 11955436 | Self-equalized and self-crosstalk-compensated 3D transmission line architecture with array of periodic bumps for high-speed single-ended signal transmission | Ying Ern Ho, Yun Rou Lim, Wil Choon Song, Stephen H. Hall | 2024-04-09 |