Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142570 | Composite bridge die-to-die interconnects for integrated-circuit packages | Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong, Seok Ling Lim | 2024-11-12 |
| 12002793 | Integrating system in package (SiP) with input/output (IO) board for platform miniaturization | Eng Huat Goh, Wee Hoe, Khang Choong Yong | 2024-06-04 |