Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183722 | Molded interconnects in bridges for integrated-circuit packages | Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong | 2024-12-31 |
| 12142570 | Composite bridge die-to-die interconnects for integrated-circuit packages | Bok Eng Cheah, Jackson Chung Peng Kong, Ping Ping Ooi, Seok Ling Lim | 2024-11-12 |
| 12002747 | Integrated bridge for die-to-die interconnects | Bok Eng Cheah, Seok Ling Lim, Kooi Chi Ooi, Jackson Chung Peng Kong | 2024-06-04 |
| 11955431 | Interposer structures and methods for 2.5D and 3D packaging | Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong, Saravanan Sethuraman | 2024-04-09 |
| 11887940 | Integrated circuit packages with conductive element having cavities housing electrically connected embedded components | Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong | 2024-01-30 |