Issued Patents 2024
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183722 | Molded interconnects in bridges for integrated-circuit packages | Jenny Shio Yin Ong, Seok Ling Lim, Bok Eng Cheah | 2024-12-31 |
| 12142570 | Composite bridge die-to-die interconnects for integrated-circuit packages | Bok Eng Cheah, Jenny Shio Yin Ong, Ping Ping Ooi, Seok Ling Lim | 2024-11-12 |
| 12112997 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Choong Kooi Chee, Wai Ling Lee, Tat Hin Tan | 2024-10-08 |
| 12080628 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Choong Kooi Chee, Wai Ling Lee, Tat Hin Tan | 2024-09-03 |
| 12033953 | Electronic device and crosstalk mitigating substrate | Min Suet Lim, Tin Poay Chuah, Bok Eng Cheah | 2024-07-09 |
| 12002747 | Integrated bridge for die-to-die interconnects | Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim, Kooi Chi Ooi | 2024-06-04 |
| 11955431 | Interposer structures and methods for 2.5D and 3D packaging | Jenny Shio Yin Ong, Seok Ling Lim, Bok Eng Cheah, Saravanan Sethuraman | 2024-04-09 |
| 11942412 | Interposer with flexible portion | Bok Eng Cheah, Min Suet Lim, Tin Poay Chuah | 2024-03-26 |
| 11887917 | Encapsulated vertical interconnects for high-speed applications and methods of assembling same | Bok Eng Cheah, Kooi Chi Ooi, Yang Liang Poh | 2024-01-30 |
| 11887940 | Integrated circuit packages with conductive element having cavities housing electrically connected embedded components | Seok Ling Lim, Jenny Shio Yin Ong, Bok Eng Cheah | 2024-01-30 |