Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12112997 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Choong Kooi Chee, Jackson Chung Peng Kong, Wai Ling Lee | 2024-10-08 |
| 12080628 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Choong Kooi Chee, Jackson Chung Peng Kong, Wai Ling Lee | 2024-09-03 |