| 12183722 |
Molded interconnects in bridges for integrated-circuit packages |
Jenny Shio Yin Ong, Seok Ling Lim, Jackson Chung Peng Kong |
2024-12-31 |
| 12142570 |
Composite bridge die-to-die interconnects for integrated-circuit packages |
Jackson Chung Peng Kong, Jenny Shio Yin Ong, Ping Ping Ooi, Seok Ling Lim |
2024-11-12 |
| 12112997 |
Micro through-silicon via for transistor density scaling |
Choong Kooi Chee, Jackson Chung Peng Kong, Wai Ling Lee, Tat Hin Tan |
2024-10-08 |
| 12080628 |
Micro through-silicon via for transistor density scaling |
Choong Kooi Chee, Jackson Chung Peng Kong, Wai Ling Lee, Tat Hin Tan |
2024-09-03 |
| 12033953 |
Electronic device and crosstalk mitigating substrate |
Min Suet Lim, Tin Poay Chuah, Jackson Chung Peng Kong |
2024-07-09 |
| 12002747 |
Integrated bridge for die-to-die interconnects |
Jenny Shio Yin Ong, Seok Ling Lim, Kooi Chi Ooi, Jackson Chung Peng Kong |
2024-06-04 |
| 11955431 |
Interposer structures and methods for 2.5D and 3D packaging |
Jenny Shio Yin Ong, Seok Ling Lim, Jackson Chung Peng Kong, Saravanan Sethuraman |
2024-04-09 |
| 11942412 |
Interposer with flexible portion |
Jackson Chung Peng Kong, Min Suet Lim, Tin Poay Chuah |
2024-03-26 |
| 11887917 |
Encapsulated vertical interconnects for high-speed applications and methods of assembling same |
Jackson Chung Peng Kong, Kooi Chi Ooi, Yang Liang Poh |
2024-01-30 |
| 11887940 |
Integrated circuit packages with conductive element having cavities housing electrically connected embedded components |
Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong |
2024-01-30 |