Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125768 | Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same | Loke Yip Foo | 2024-10-22 |
| 12112997 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Jackson Chung Peng Kong, Wai Ling Lee, Tat Hin Tan | 2024-10-08 |
| 12080628 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Jackson Chung Peng Kong, Wai Ling Lee, Tat Hin Tan | 2024-09-03 |