Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125768 | Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same | Choong Kooi Chee | 2024-10-22 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125768 | Face-to-face through-silicon via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same | Choong Kooi Chee | 2024-10-22 |