Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887917 | Encapsulated vertical interconnects for high-speed applications and methods of assembling same | Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi | 2024-01-30 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887917 | Encapsulated vertical interconnects for high-speed applications and methods of assembling same | Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi | 2024-01-30 |