Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002747 | Integrated bridge for die-to-die interconnects | Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim, Jackson Chung Peng Kong | 2024-06-04 |
| 11887917 | Encapsulated vertical interconnects for high-speed applications and methods of assembling same | Bok Eng Cheah, Jackson Chung Peng Kong, Yang Liang Poh | 2024-01-30 |