Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955431 | Interposer structures and methods for 2.5D and 3D packaging | Jenny Shio Yin Ong, Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong | 2024-04-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955431 | Interposer structures and methods for 2.5D and 3D packaging | Jenny Shio Yin Ong, Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong | 2024-04-09 |