Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12003023 | In-package 3D antenna | Zhenguo Jiang, Omkar G. Karhade, Srichaitra Chavali, Zhichao Zhang, Stephen Andrew Smith +2 more | 2024-06-04 |
| 11929295 | Multi-use package architecture | Eng Huat Goh, Jiun Hann Sir, Min Suet Lim, Richard C. Stamey, Chu Aun Lim | 2024-03-12 |
| 11870163 | Antenna package using ball attach array to connect antenna and base substrates | Robert L. Sankman, Shawna M. Liff, Sri Chaitra Jyotsna Chavali, William J. Lambert, Zhichao Zhang | 2024-01-09 |