Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11929295 | Multi-use package architecture | Eng Huat Goh, Min Suet Lim, Richard C. Stamey, Chu Aun Lim, Jimin Yao | 2024-03-12 |
| 11908793 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Poh Boon Khoo, Eng Huat Goh, Amruthavalli Pallavi Alur, Debendra Mallik | 2024-02-20 |