Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046560 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta +1 more | 2024-07-23 |
| 11955426 | Package-integrated multi-turn coil embedded in a package magnetic core | Huong Do, Kaladhar Radhakrishnan, Krishna Bharath, Yikang Deng | 2024-04-09 |
| 11935805 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2024-03-19 |
| 11923257 | Hybrid microelectronic substrates | Robert Starkston, Robert L. Sankman, Scott M. Mokler, Richard C. Stamey | 2024-03-05 |
| 11908793 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Eng Huat Goh, Debendra Mallik | 2024-02-20 |
| 11894311 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta +1 more | 2024-02-06 |