Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908793 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Eng Huat Goh, Amruthavalli Pallavi Alur, Debendra Mallik | 2024-02-20 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908793 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Eng Huat Goh, Amruthavalli Pallavi Alur, Debendra Mallik | 2024-02-20 |