Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11929212 | Method to form high capacitance thin film capacitors (TFCs) as embedded passives in organic substrate packages | Gang Duan, Srinivas V. Pietambaram, Kristof Darmawikarta | 2024-03-12 |
| 11929330 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Bai Nie, Jesse C. Jones +1 more | 2024-03-12 |
| 11923312 | Patternable die attach materials and processes for patterning | Bai Nie, Gang Duan, Srinivas V. Pietambaram, Jesse C. Jones, Yosuke Kanaoka +10 more | 2024-03-05 |