Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170182 | Ribbon beam angle adjustment in an ion implantation system | Chi-Ming Huang, Shao-Yu HU | 2024-12-17 |
| 12094800 | Thermally conductive slugs/active dies to improve cooling of stacked bottom dies | Jin Yang, Chia-Pin Chiu, Peng Li, Deepak Goyal | 2024-09-17 |
| 12057369 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal | 2024-08-06 |
| 12046536 | Integrated heat spreader with enhanced vapor chamber for multichip packages | Je-Young Chang, James C. Matayabas, Jr., Kyle Arrington | 2024-07-23 |
| 11901262 | Cooling solution including microchannel arrays and methods of forming the same | Nicholas Neal, Shankar Devasenathipathy, Je-Young Chang | 2024-02-13 |
| 11894282 | Vented lids for integrated circuit packages | Sergio Antonio Chan Arguedas, Peng Li, Chandra Mohan Jha, Aravindha R. Antoniswamy, Cheng Xu +2 more | 2024-02-06 |