Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057369 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Kyle Arrington, Aaron McCann, Nicholas Neal, Zhimin Wan | 2024-08-06 |
| 11923268 | Printed heat spreader structures and methods of providing same | Jesus Gerardo Reyes Schuldes, Pramod Malatkar, Aravindha R. Antoniswamy, Kyle Arrington | 2024-03-05 |
| 11901262 | Cooling solution including microchannel arrays and methods of forming the same | Nicholas Neal, Zhimin Wan, Je-Young Chang | 2024-02-13 |