Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923268 | Printed heat spreader structures and methods of providing same | Jesus Gerardo Reyes Schuldes, Shankar Devasenathipathy, Pramod Malatkar, Kyle Arrington | 2024-03-05 |
| 11894282 | Vented lids for integrated circuit packages | Zhimin Wan, Sergio Antonio Chan Arguedas, Peng Li, Chandra Mohan Jha, Cheng Xu +2 more | 2024-02-06 |
| 11881438 | First-level integration of second-level thermal interface material for integrated circuit assemblies | Elah Bozorg-Grayeli, Kyle Arrington, Sergio Antonio Chan Arguedas | 2024-01-23 |
| 11869824 | Thermal interface structures for integrated circuit packages | Kyle Arrington, Aaron McCann, Kelly Lofgreen, Elah Bozorg-Grayeli, Joseph B. Petrini | 2024-01-09 |