Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984377 | IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects | Debendra Mallik, Je-Young Chang, Ram Viswanath, Ahmad Al Mohammad | 2024-05-14 |
| 11935799 | Integrated circuit package lids with polymer features | Taylor Gaines, Frederick Atadana, Sergio Antonio Chan Arguedas, Robert F. Cheney | 2024-03-19 |
| 11935808 | IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects | Debendra Mallik, Je-Young Chang, Ram Viswanath, Ahmad Al Mohammad | 2024-03-19 |
| 11923267 | IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects | Debendra Mallik, Je-Young Chang, Ram Viswanath, Ahmad Al Mohammad | 2024-03-05 |
| 11881440 | Carbon based polymer thermal interface materials with polymer chain to carbon based fill particle bonds | Marely E. Tejeda Ferrari, Taylor Gaines, James C. Matayabas, Jr. | 2024-01-23 |
| 11881438 | First-level integration of second-level thermal interface material for integrated circuit assemblies | Kyle Arrington, Sergio Antonio Chan Arguedas, Aravindha R. Antoniswamy | 2024-01-23 |
| 11869824 | Thermal interface structures for integrated circuit packages | Kyle Arrington, Aaron McCann, Kelly Lofgreen, Aravindha R. Antoniswamy, Joseph B. Petrini | 2024-01-09 |