Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935799 | Integrated circuit package lids with polymer features | Elah Bozorg-Grayeli, Frederick Atadana, Sergio Antonio Chan Arguedas, Robert F. Cheney | 2024-03-19 |
| 11935861 | Underfill flow management in electronic assemblies | Frederick Atadana, Edvin Cetegen, Wei Li, Hsin-Yu Li, Tony Dambrauskas | 2024-03-19 |
| 11881440 | Carbon based polymer thermal interface materials with polymer chain to carbon based fill particle bonds | Marely E. Tejeda Ferrari, Elah Bozorg-Grayeli, James C. Matayabas, Jr. | 2024-01-23 |