| 12087731 |
No mold shelf package design and process flow for advanced package architectures |
Edvin Cetegen, Nicholas S. Haehn, Ram Viswanath, Nicholas Neal, Mitul Modi |
2024-09-10 |
| 12002727 |
Barrier structures for underfill containment |
Ziyin Lin, Vipul V. Mehta, Edvin Cetegen, Xavier Francois Brun, Yang Guo +6 more |
2024-06-04 |
| 11942393 |
Substrate with thermal insulation |
Edvin Cetegen, Nicholas S. Haehn, Mitul Modi, Nicholas Neal |
2024-03-26 |
| 11935861 |
Underfill flow management in electronic assemblies |
Frederick Atadana, Taylor Gaines, Edvin Cetegen, Hsin-Yu Li, Tony Dambrauskas |
2024-03-19 |
| 11901333 |
No mold shelf package design and process flow for advanced package architectures |
Edvin Cetegen, Nicholas S. Haehn, Ram Viswanath, Nicholas Neal, Mitul Modi |
2024-02-13 |
| 11887962 |
Microelectronic structures including bridges |
Omkar G. Karhade, Nitin A. Deshpande, Mohit Bhatia, Sairam Agraharam, Edvin Cetegen +6 more |
2024-01-30 |