Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087731 | No mold shelf package design and process flow for advanced package architectures | Edvin Cetegen, Nicholas S. Haehn, Ram Viswanath, Nicholas Neal, Mitul Modi | 2024-09-10 |
| 12002727 | Barrier structures for underfill containment | Ziyin Lin, Vipul V. Mehta, Edvin Cetegen, Xavier Francois Brun, Yang Guo +6 more | 2024-06-04 |
| 11942393 | Substrate with thermal insulation | Edvin Cetegen, Nicholas S. Haehn, Mitul Modi, Nicholas Neal | 2024-03-26 |
| 11935861 | Underfill flow management in electronic assemblies | Frederick Atadana, Taylor Gaines, Edvin Cetegen, Hsin-Yu Li, Tony Dambrauskas | 2024-03-19 |
| 11901333 | No mold shelf package design and process flow for advanced package architectures | Edvin Cetegen, Nicholas S. Haehn, Ram Viswanath, Nicholas Neal, Mitul Modi | 2024-02-13 |
| 11887962 | Microelectronic structures including bridges | Omkar G. Karhade, Nitin A. Deshpande, Mohit Bhatia, Sairam Agraharam, Edvin Cetegen +6 more | 2024-01-30 |