Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176292 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more | 2024-12-24 |
| 12080620 | Additively manufactured structures for heat dissipation from integrated circuit devices | Feras Eid, Paul Diglio, Joe Walczyk, Sergio Antonio Chan Arguedas | 2024-09-03 |
| 12066584 | Fast power on method for marine acquisition streamer | Nicolas Fradin | 2024-08-20 |
| 12021016 | Thermally enhanced silicon back end layers for improved thermal performance | Chandra Mohan Jha, Pooya Tadayon, Aastha Uppal, Weihua Tang, Paul Diglio | 2024-06-25 |
| 12002727 | Barrier structures for underfill containment | Ziyin Lin, Vipul V. Mehta, Wei Li, Edvin Cetegen, Yang Guo +6 more | 2024-06-04 |
| 11978689 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Robert L. Sankman, Pooya Tadayon | 2024-05-07 |