| 12136577 |
Integrated circuit die packages including a contiguous heat spreader |
Feras Eid, Paul Diglio |
2024-11-05 |
| 12135460 |
Stackable photonics die with direct optical interconnect |
Todd Coons, Michael Rutigliano, Abram M. Detofsky |
2024-11-05 |
| 12087658 |
Hybrid thermal interface material (TIM) with reduced 3D thermal resistance |
Pooya Tadayon |
2024-09-10 |
| 12080620 |
Additively manufactured structures for heat dissipation from integrated circuit devices |
Feras Eid, Xavier Francois Brun, Paul Diglio, Sergio Antonio Chan Arguedas |
2024-09-03 |
| 12061230 |
Active optical plug to optically or electrically test a photonics package |
Todd Coons, Michael Rutigliano, Abram M. Detofsky |
2024-08-13 |
| 12009612 |
Dual-sided socket device with corrugation structures and shield structures |
Srikant Nekkanty, Steven A. Klein, Feroz Mohammad, Kuang Liu, Zhichao Zhang |
2024-06-11 |
| 11948906 |
Hybrid backside thermal structures for enhanced IC packages |
Feras Eid, Weihua Tang, Akhilesh Rallabandi, Marco Aurelio Cartas Ayala |
2024-04-02 |
| 11935860 |
Electrical connector with insulated conductive layer |
Morten S. Jensen, Michael E. Ryan, Srikant Nekkanty |
2024-03-19 |