Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136577 | Integrated circuit die packages including a contiguous heat spreader | Feras Eid, Paul Diglio | 2024-11-05 |
| 12135460 | Stackable photonics die with direct optical interconnect | Todd Coons, Michael Rutigliano, Abram M. Detofsky | 2024-11-05 |
| 12087658 | Hybrid thermal interface material (TIM) with reduced 3D thermal resistance | Pooya Tadayon | 2024-09-10 |
| 12080620 | Additively manufactured structures for heat dissipation from integrated circuit devices | Feras Eid, Xavier Francois Brun, Paul Diglio, Sergio Antonio Chan Arguedas | 2024-09-03 |
| 12061230 | Active optical plug to optically or electrically test a photonics package | Todd Coons, Michael Rutigliano, Abram M. Detofsky | 2024-08-13 |
| 12009612 | Dual-sided socket device with corrugation structures and shield structures | Srikant Nekkanty, Steven A. Klein, Feroz Mohammad, Kuang Liu, Zhichao Zhang | 2024-06-11 |
| 11948906 | Hybrid backside thermal structures for enhanced IC packages | Feras Eid, Weihua Tang, Akhilesh Rallabandi, Marco Aurelio Cartas Ayala | 2024-04-02 |
| 11935860 | Electrical connector with insulated conductive layer | Morten S. Jensen, Michael E. Ryan, Srikant Nekkanty | 2024-03-19 |