Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11948906 | Hybrid backside thermal structures for enhanced IC packages | Feras Eid, Joe Walczyk, Weihua Tang, Akhilesh Rallabandi | 2024-04-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11948906 | Hybrid backside thermal structures for enhanced IC packages | Feras Eid, Joe Walczyk, Weihua Tang, Akhilesh Rallabandi | 2024-04-02 |