Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021016 | Thermally enhanced silicon back end layers for improved thermal performance | Chandra Mohan Jha, Pooya Tadayon, Aastha Uppal, Paul Diglio, Xavier Francois Brun | 2024-06-25 |
| 11978689 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Shrenik Kothari, Chandra Mohan Jha, Robert L. Sankman, Xavier Francois Brun, Pooya Tadayon | 2024-05-07 |
| 11948906 | Hybrid backside thermal structures for enhanced IC packages | Feras Eid, Joe Walczyk, Akhilesh Rallabandi, Marco Aurelio Cartas Ayala | 2024-04-02 |