Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021016 | Thermally enhanced silicon back end layers for improved thermal performance | Pooya Tadayon, Aastha Uppal, Weihua Tang, Paul Diglio, Xavier Francois Brun | 2024-06-25 |
| 11978689 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Shrenik Kothari, Weihua Tang, Robert L. Sankman, Xavier Francois Brun, Pooya Tadayon | 2024-05-07 |
| 11894282 | Vented lids for integrated circuit packages | Zhimin Wan, Sergio Antonio Chan Arguedas, Peng Li, Aravindha R. Antoniswamy, Cheng Xu +2 more | 2024-02-06 |