Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057369 | Enhanced base die heat path using through-silicon vias | Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal, Zhimin Wan | 2024-08-06 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057369 | Enhanced base die heat path using through-silicon vias | Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal, Zhimin Wan | 2024-08-06 |