Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12156376 | Two-phase immersion-type heat dissipation structure having porous structure | Chun-Te Wu, TZE-YANG YEH | 2024-11-26 |
| 12140386 | Heat-dissipating substrate structure | TZE-YANG YEH | 2024-11-12 |
| 12108574 | Two-phase immersion-type heat dissipation structure having fins for facilitating bubble generation | Chun-Te Wu, Yu-Wei Chiu, TZE-YANG YEH | 2024-10-01 |
| 12092406 | Two-phase immersion-type heat dissipation structure having non-vertical fins | Chun-Te Wu, TZE-YANG YEH | 2024-09-17 |
| 11988467 | Liquid-cooling heat dissipation plate with pin-fins and enclosed liquid cooler having the same | Chun-Lung Wu, TZE-YANG YEH | 2024-05-21 |